PEER REVIEWED ARCHIVAL PUBLICATIONS

Book Chapter

1.  P. Kumar, Z. Huang, I. Dutta, G. Subbarayan and R. Mahajan, "Microstructural Effects on Creep and Fracture Toughness of Sn-Ag-Cu Solder Joints", Chapter 8 in Lead-free Solders: Materials Reliability for Electronics, edited by K. N. Subramanian, Wiley series in Electronic and Optoelectronic Materials, John Wiley, 2012
Google Link to Book

2.  P. Kumar, I. Dutta, Z. Hunag and P. Conway, "Materials and Processing of TSV", Chapter 3 in 3D Microelectronic Packaging: From Fundamentals to Applications Edited by Yan Li and Deepak Goyal, Springer Series in Advanced Microelectronics, 2017 (1st Ed), 2021 (2nd Ed.)
Link to Book Chapter (2nd Ed.)

3.  P. Kumar, I. Dutta, Z. Hunag and P. Conway, "Microstructural and Reliability Issues of TSV", Chapter 4 in 3D Microelectronic Packaging: From Fundamentals to Applications, Edited by Yan Li and Deepak Goyal, Springer Series in Advanced Microelectronics, 2017 (1st Ed), 2021 (2nd Ed.)
Link to Book Chapter (2nd Ed.)

4.  P. Kumar, "Electromigration in Metallic Materials and Its Role in Whiskering", Chapter 5 in Handbook of Solid State Diffusion: Volume 2, Diffusion Analysis in Material Applications, Edited by Aloke Paul and Sergiy Divinski, Elsevier, 2017
Link to Book Chapter

Journals

121.  S. P.Singh, V. Jayaram, D. Srinivasan and P. Kumar, “High Throughput Determination of Creep Behavior of Additively Manufactured AlSi10Mg Alloy”, Additive Manufacturing 58 (2022) 103049.
Link to paper

120.   V. Shastri, S. Talukder, K. Roy, P. Kumar and R. Pratap, “Manipulating liquid metal flow for creating standalone structures with micro-and nano-scale features in single step”, Nanotechnology 33 (2022) 455301.
Link to paper

119.  M. E. Kassner, T. Oros and P. Kumar, “Comments on the Mechanism of Detachment in Creep of Dispersion Strengthened Alloys at High Temperatures”, Metals 12 (2022) 1191.
Link to paper

118.  S. P.Singh, A. Rijal, T. Straub, J-K. Han, T. Kennerknecht, C. Eberl, M. Kawasaki and P. Kumar, “Effect of high-pressure torsion on high cycle fatigue of commercially pure Cu: Some insights from formation of surface micro-cracks”, Mater. Characterization 20 (2022) 112059.
Link to paper

117.  D. Lal. V. Ramanadham, P. Kumar, S. Sampath and V. Jayaram, “Damage accumulation in plasma-sprayed zirconia undercyclic loading”, J Am Ceram Soc. 105 (2022) 5883.
Link to paper

116.  A. Kanjilal, Ramesh Narayanan P and P. Kumar, “Transition from necking to cavitation driven tertiary creep with length scale in constrained ductile metal joints”, Mater. Sci. Eng. 845A (2022) 143205.
Link to paper

115.  V. Shastri, S. talukder, K. Roy, P. Kumar and R. Pratap, “Spontaneous Formation of Structures with Micro- and Nano-Scopic Periodic Ripple Patterns”, ACS Omega 7 (2022) 12111
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114.  F. Hijazi, D. Srinivasan, B. Roy, P. Kumar and V. Jayaram, “Micro-texture regions in rolled Ti-6Al-4V under polarized light”, Scripta Materialia 213 (2022) 114588.
Link to paper

113.  A Kanjilal and P Kumar, “Size Dependent Creep Deformation of Elastically Constrained Compliant Metallic Joints”, Materialia 21 (2022) 101322.
Link to paper

112.  S. Kumar, E. Abraham, P. Kumar, R. Pratap, “Introducing Water Electrolithography”, ACS Omega 6 (2021) 25692.
Link to paper

111.  T. Baskaran, N. Esakkiraja, C. Samartha, P. Kumar, V. Jayaram, A. Paul, “Effect of addition of Pt, Pd and Ir to β-NiAl-bond coat on oxidation resistance and growth of interdiffusion zone”, Surf. Coat. Technol. 426 (2021) 127766.
Link to paper

110.  R. Sunder, D. Raut, V. Jayaram, P. Kumar and V. Shashtri “Near-tip residual stress as an independent load interaction mechanism”, Int. J. Fatigue 151 (2021) 106364.
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109.  D. Lal, P. Kumar, R. Bathe, S. Sampath and V. Jayaram, “Effect of microstructure on fracture behavior of freestanding plasma sprayed 7 wt.% Y2O3 stabilized ZrO2”, J. Euro. Ceram. Soc. 41 (2021) 4294.
Link to paper

108.  D. Sonawane and P. Kumar, “Stability of Cu-islands Formed on Si Substrate via “Dewetting” under Subsequent Thermal Cycling”, Nanotechnology 32 (2021) 195703.
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107.  P. Jagtap and P. Kumar, "Whisker Growth in Sn Coatings: A Review of Current Status and Future Prospects”, J. Elec. Mater. 50 (2021) 735.
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106.  D. Sonawane and P. Kumar, “Role of Grain Boundary Sliding in Structural Integrity of Cu-Filled Through Si Via During Isothermal Annealing”, J. Elec. Mater. 50 (2021) 767.
Link to paper

105.  S. I. A. Jalali, V. Jayarm and P. Kumar "Creep Micromechanics in Meso-Length Scale Samples”, Acta Mater. 205 (2021) 116535.
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104.  S. I. A. Jalali, P. Kumar and V. Jayaram, "Customized High-Temperature Bending with DIC for High-Throughput Determination of Creep Parameters: Technique, Instrumentation, and Optimization”, J. Metal. (JOM) 72 (2020) 4522.
Link to paper

103.  S. Kumar, H. Suresh, V. A. Sethuraman, P. Kumar and R. Pratap, “Electric field induced patterning in Cr film under ambient conditions: A chemical reaction based perspective”, SN App. Sci. 2 (2020) 2073.
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102.  S. P. Singh, P. Kumar and M. E. Kassner, “Frustration of the dislocation density in NaCl and its implication on “Harper-Dorn” creep”, Mater. Sci. Eng. 799 (2020) 140360.
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101.  D. Sonawane and P. Kumar, “New Insights into Fracture of Si in Cu-Filled Through Silicon Via during and after Thermal Annealing”, Engineering Fracture Mechanics 238 (2020) 107281
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100.  S. Kumar, S. Telpande, V. Manikandan, P. Kumar and A. Misra, “Novel Electrode Geometry for High Performance CF/Fe2O3 based Planar Solid State Micro-electrochemical Capacitor”, Nanoscale 12 (2020) 19438.
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99.  S. P. Singh, P. Kumar and M. E. Kassner, “The low-stress and high-temperature creep in LiF single crystals: An explanation for the So-called Harper-Dorn creep”, Materialia 13 (2020) 100864. ( Winner of Acta Student Award 2020)
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98.  D. Sonawane, A. Choudhury and P. Kumar, “New Insights into Dewetting of Cu Thin Films Deposited on Si”, Langmuir 36 (2020) 5534
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97.  D. Lal, P. Kumar, S. Sampath and V. Jayaram, “Hysteretic and Time Dependent Deformation of Plasma Sprayed Zirconia Ceramics”, Acta Mater 194 (2020) 394
Link to paper

96.  R. Ghosh, S. Telpande, P. Gowda, S. K. Reddy, P. Kumar and A. Misra, “Deterministic Role of Carbon Nanotube-Substrate Coupling for Ultrahigh Actuation in Bilayer Electrothermal Actuators”, ACS Appl Mater Interfaces 12 (2020) 26.
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95.  M. Sharma, P. Kumar, A. V. Irzhak, S. Kumar, R. Pratap, S. V. von Gratovski, V. G. Shavrov and V. V. Koledov, “Melting and Electromigration in Thin Chromium Films”, Phys. Solid State 62 (2020)988
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94.  N. Somaiah, A. Kanjilal and P. Kumar, “Effects of an interfacial layer on stress relaxation mechanisms active in the Cu–Si thin film system during thermal cycling”, MRS Communications 10 (2020) 164.
Link to paper

93.  S. I. A. Jalali, P. Kumar and V. Jayaram, “Microstructural equivalence between bending and uniaxial creep”, Scripta Mater 186 (2020) 99.
Link to paper

92.  P. Tan, P. Kumar and I. Dutta, “A cutting mechanism map for machining metallic sheets using electric current pulses”, Eng Res Exp 2 (2020) 025035
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91.  D. Sharma, I. Dutta and P. Kumar, “A technique for machining thin metallic foils using electromagnetic-mechanical pulsed loading”, Eng. Res. Exp. 2 (2020) 015031.
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90.  S. I. A. Jalali, P. Kumar and V. Jayaram, “High Throughput Determination of Creep Parameters Using Cantilever Bending: Part II - Primary and Steady-State through Uniaxial Equivalency”, J. Mater. Res. 35 (2020) 362.
Link to paper

89.  S. I. A. Jalali, P. Kumar and V. Jayaram, “High Throughput Determination of Creep Parameters Using Cantilever Bending: Part I - Steady-State”, J. Mater. Res. 35 (2020) 353.
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88.  A. Rijal, S. P. Singh, J. K. Han, M. Kawasaki and P. Kumar, “Effect of High-Pressure Torsion on Hardness and Electrical Resistivity of Commercially Pure Cu”, Advanced Engineering Materials 22 (2020) 1900547
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87.  D. Lal, P. Kumar, S. Sampath and V. Jayaram “Low-temperature stiffening of air plasma-sprayed 7 wt% Y2O3-stabilized ZrO2”, J. Am. Ceram. Soc. 103 (2020) 2076.
Link to paper

86.  N. Somaiah and P. Kumar, “Effect of Thermomigration-Electromigration Coupling on Mass Transport in Cu Thin Films”, J. Elec. Mater. 49 (2020) 96.
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85.  D. S. Sonwane, P. C. Ramamurthy and P. Kumar, “Mechanical Reliability of Photovoltaic Cells under Cyclic Thermal Loading”, J. Elec. Mater. 49 (2020) 59.
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84.   A. Rijal, S.P. Singh, J. Han, M. Kawasaki and P. Kumar, “Effect of HPT processing followed by long term natural ageing on mechanical and electrical properties of commercially pure Cu”, Lett. Mater. 9 (2019) 561.
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83.  N. Somaiah and P. Kumar, “Tuning Sample Length Effect on Mass Transport in Current Carrying Cu-Si Thin Film Systems via Interfacial Engineering”, Nanotechnology 30 (2019) 485704.
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82.  S. P. Singh, X-R. Huang, P. Kumar and M. E. Kassner, “Short Communication: Assessment of the Dislocation Density Using X-ray Topography in Al Single Crystals Annealed for Long Times Near the Melting Temperature”, Materials Today: Communications 21 (2019) 100613.
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81.   S. Talukder, B. Gogoi, P. Kumar, R. Pratap, R. Maoz and J. Sagiv, “Advanced Nanopatterning Using Scanning Probe Technology”, Materials Today: Proceedings 18 (2019) 740
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80.  S. I. A. Jalali, P. Kumar and V. Jayaram, “Creep of Metallic Materials in Bending”, JOM 71 (10) (2019) 3565.
Link to paper

79.  F. Hijazi, J. Kar, A. H. V. Pavan, K. Singh, P. Kumar and V. Jayaram, “Application of Bending Creep for Examining Effect of Service Conditions on Creep Response of Steel”, Mater. Sci. Eng. 766 A (2019) 138398
Link to paper

78.  S. P. Singh, D. Sonawane and P. Kumar, “Creep of Cu-Bi Alloys with High Bi Content Near and Above Melting Temperature of Bi”, Metall. Mater. Trans. A50 (2019) 2690.
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77.  D. Sharma and P. Kumar, “Failure of thin metallic conductors under electric current loading: Transition from sharp crack to blow-hole”, Eng. Fracture Mech. 208 (2019) 221.
Link to paper

76.  N. Somaiah and P. Kumar, “Inverse Blech Length Phenomenon in Thin-Film Stripes”, Phys. Rev. Applied 10 (2018) 054052.
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75.   N. Somaiah and P. Kumar, “Tuning electromigration-thermomigration coupling in Cu/W Blech structures”, J. Appl. Phys. 124 (2018) 185102.
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74.   D. Sharma, B. Subba Reddy and P. Kumar, “Fracture of pre-cracked metallic conductors under combined electric current and mechanical loading”, Int. J. Fracture 212 (2018) 167.
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73.   D. Sharma, B. Subba Reddy and P. Kumar, “Fracture of pre-cracked thin metallic conductors due to electric current induced electromagnetic force”, Int. J. Fracture 212 (2018) 183.
Link to paper

72.   P. Jagtap, R. Narayanan P., and P. Kumar, “Effect of Substrate Composition on Whisker Growth in Sn Coatings”, J. Elec. Mater. 47 (2018) 4177.
Link to paper Springer Nature Link is: here (Freely Available)

71.   P. Jagtap, V. Sethuraman, and P. Kumar, “Critical Evaluation of Relative Importance of Stress and Stress Gradient in Whisker Growth in Sn Coatings”, J. Elec. Mater. 47 (2018) 5229.
Link to paper Springer Nature Link is: here (Freely Available)

70.   D. Sharma, A. Jain, N. Somaiah, R. Narayanan P., and P. Kumar, “Effect of Embedding Cu-Graphene Hybrid Powder into 2-Phase In-Cu Solders on Its Suitability as Metallic Thermal Interface Material”, J. Elec. Mater. 47 (2018) 4863.
Link to paper Springer Nature Link is: here (Freely Available)

69.   S. Chakraborty, P. Kumar and A. Choudhury, “Phase-Field Modeling of Grain-Boundary Grooving and Migration under Electric Current and Thermal Gradient”, Acta Mater 153 (2018) 377.
Link to paper

68.   V. A. Baheti, S. Kashyap, P. Kumar, K. Chattopadhyay and A. Paul, “Solid state diffusion–controlled growth of the phases in the Au–Sn system”, Phil. Mag. 98 (2018) 20.
Link to paper

67.   A. Kanjilal and P. Kumar, “Growth of Interfacial Intermetallic Compound Layer in Diffusion-Bonded SAC–Cu Solder Joints During Different Types of Thermomechanical Excursion ”, J. Elec. Mater. 47 (2018) 457.
Link to paper Springer Nature Link is: here (Freely Available)

66.   V. A. Baheti, P. Kumar and A. Paul, “Growth of phases in the solid-state from room temperature to an elevated temperature in the Pd–Sn and the Pt–Sn systems ”, J. Mater. Sci.: Mater. Electronics 28 (2017) 18379.
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65.   V. A. Baheti, P. Kumar and A. Paul, “Effect of Au, Pd and Pt addition in Cu on the growth of intermetallic compounds and the Kirkendall voids in the Cu-Sn system”, J. Mater. Sci.: Mater. Electronics 28 (2017) 17014
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64.   S. Kumar, P. Kumar and R. Pratap, “A Model for Electromigration Induced Flow in Liquid Metals”, J. Phys. D: Applied Physics 50 (2017) 39LT02.
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63.   V. A. Baheti, S. Kashyap, P. Kumar, K. Chattopadhyay and A. Paul, “Solid–state diffusion–controlled growth of the intermediate phases from room temperature to an elevated temperature in the Cu–Sn and the Ni–Sn systems”, J. Alloy Compounds 727(2017) 832.
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62.   K. Smith, M. E. Kassner and P. Kumar, “Long-term Annealing of High Purity Aluminum Single Crystals: New Insights into Harper-Dorn Creep”, Mater Sci Eng A 705(2017) 1.
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61.   A. Kanjilal, V. Jangid and P. Kumar, “Critical Evaluation of Creep Behavior of Sn-Ag-Cu Solder Alloys over Wide Range of Temperatures”, Mater Sci Eng A 703(2017) 144.
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60.   P. Jagtap, A. Chakraborty, P. Eisenlohr and P. Kumar, “Identification of whisker grain in Sn coatings by analyzing crystallographic micro-texture using electron back-scatter diffraction”, Acta Mater 134 (2017) 346.
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59.   R. Ghosh, A. Kanjilal and P. Kumar, “Effect of type of thermo-mechanical excursion on growth of interfacial intermetallic compounds in Cu/Sn-Ag-Cu solder joints”, Microelectronic Reliability 74 (2017) 44.
Link to paper

58.   V. A. Baheti, S. Kashyap, P. Kumar, K. Chattopadhyay and A. Paul, “Bifurcation of the Kirkendall marker plane and the role of Ni and other impurities on the growth of Kirkendall voids in the Cu-Sn system”, Acta Mater. 131 (2017) 260.
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57.   V. A. Baheti, S. Kashyap, P. Kumar, K. Chattopadhyay and A. Paul, “Effect of Ni on growth kinetics, microstructural evolution and crystal structure in the Cu(Ni)–Sn system”, Phil. Mag. 97 (2017) 1782. ( Winner of James Clerk Maxwell Prize 2017)
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56.   M. Kawasaki, B. Ahn, P. Kumar, J.-I. Jang, T. G. Langdon , “Nano- and Micro-mechanical Properties of Ultrafine-Grained Materials Processed by Severe Plastic Deformation Techniques”, Adv. Eng. Mater. 19 (2017) 1600578.
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55.   P. Kumar, M. Kawasaki and T. G. Langdon, “Resolving the Strength-Ductility Paradox through Severe Plastic Deformation of a Cast Al-7Si Alloy”, Mater. Sci. Forum 879 (2017) 1043.
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54.   S. P. Singh, B. K. Deb Barman and P Kumar, “Cu-Bi alloys with high volume fraction of Bi: A material potentially suitable for thermal surge protection and energy storage”, Mater. Sci. Eng. 677A (2016) 140.
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53.  D. Sonawane, S. Oberoi and P. Kumar, "Effect of Aspect Ratio of Test Specimens on Quasistatic Compression Loading and Stress-Relaxation of PDMS and a Cu-Filled-PDMS Composite", Polymer Testing 55(2016)173.
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52.   P. Jagtap, A. Kumar and P. Kumar, "Effect of Electric Field on Creep and Stress-relaxation Behavior of Carbon Nanotube Forests", RSC Adv 6(2016)67685.
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51.   B. K. Deb Barman, S. P. Singh and P Kumar, “Processing and Mechanical Behavior of Cu-Bi Alloys with High Volume Fraction of Bi: Suitability for High Temperature Soldering Application”, Mater. Sci. Eng. 666A (2016) 339.
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50.   N. Somaiah, D. Sharma and P. Kumar, “Electric current induced forward and anomalous backward mass transport”, J. Phys. D. 49 (2016) 20LT01.
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49.   S. Oberoi, D. Sonawane and P Kumar "Effect of Strain Rate and Filler Size on Mechanical Behavior of a Cu Filled Elastomer Based Composite", Comp. Sci. Technol. 127(2016)185.
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48.   D. Sharma, R. K. Tiwari, R. Sharma, P. R. Narayanan and P Kumar "Two-Phase Metallic Thermal Interface Materials Processed Through Liquid Phase Sintering Followed by Accumulative Roll Bonding", IEEE Trans. Comp. Packag. Technol 6(2016)58.
Link to paper

47.   V. A. Baheti, S. Islam, P. Kumar, R. Ravi, R. Narayanan, D. Hongqun, V. Vuorinen, T. Laurila and A. Paul "Effect of Ni content on the diffusion-controlled growth of the product phases in the Cu(Ni)–Sn system", Phil. Mag. 96(2016)15.
Link to paper

46.   P. Kumar, M. Kawasaki and T. G. Langdon "Review- Overcoming the Paradox of Strength and Ductility in Ultrafine-Grained Materials at Low Temperatures", J. Mater. Sci. 51(2016)7. (First Paper in 50th Anniversary Issue)
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45.   S. Talukder, P. Kumar and R. Pratap,"Electrolithography- A New and Versatile Process for Nano Patterning", Scientific Reports 5 (2015) Art # 17753 . (Selected as show case article amongst 74 articles published on 4th Dec,2015)
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44.   P. Jagtap, S. K. Reddy, D. Sharma and P. Kumar, “Tailoring Energy Absorption Capacity of Carbon Nanotube Foams through Application of Electric Field”, Carbon 95 (2015), 126.
Link to paper

43.   S. K. Reddy, D. Lal, A. Misra and P. Kumar,"Novel Architecture for Anomalous Strengthening of a Particulate Filled Polymer Matrix Composite", RSC Adv. 5 (2015) 62477.
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42.   S. Talukder, P. Kumar and R. Pratap,"Controlled Material Transport and Multidimensional Patterning at Small Length Scales using Electromigration", Current Science 108 (2015) 2167. (Selected for cover page illustration)
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41.  T. Mungole, P. Kumar, M. Kawasaki and T. G. Langdon, "The Contribution of Grain Boundary Sliding in Tensile Deformation of an Ultrafine-Grained Aluminum Alloy having High Strength and High Ductility", J. Mater. Sci. 50 (2015) 3549.
Link to paper

40.  P. Jagtap and P. Kumar, "Manipulating Crystallographic Texture of Sn Coatings by Optimization of Electrodeposition Process Conditions to Suppress Growth of Whiskers", J. Elec. Mater. 44 (2015) 1206. (Editors' choice; Freely available)
Link to paper

39.  P. Jagtap and P. Kumar, "Evaluating Shock Absorption Behavior of Small-Sized Systems under Programmable Electric Field", Review of Scientific Instruments 85 (2014) 113903.
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38.  A. Misra and P. Kumar, "Tailoring Viscoelastic Response of Carbon Nanotubes Cellular Structure Using Electric Field", Nanoscale 6 (2014) 13668.
Link to paper

37. T. Mungole, P. Kumar, M. Kawasaki and T. G. Langdon, "A Critical Examination of the Paradox of Strength and Ductility in Ultrafine-Grained Metals", J. Mater. Res. 29 (2014) 2534.
Link to paper

36. S. Talukder, P. Kumar and R. Pratap, “Film Thickness Mediated Transition in the Kinetics of Electric Current Induced Flow of Thin Liquid Metal Films" Appl. Phys. Lett. 104 (2014) 214102.
Link to paper

35. P. Kumar and S. Awasthi, “Mechanical and Thermal Modeling of In-Cu Composites for Thermal Interface Materials Applications" J. Comp. Mater. 48 (2014) 1391.
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34. P. Gowda, P. Kumar, R. Tripathi and A. Misra, “Electric field induced ultra-high actuation in a bulk carbon nanotube structure" Carbon 67 (2014) 546.
Link to paper

33. A. Roy, S. Kundu, K. Müller, A. Rosenauer, S. Singh, P. Pant, M. P. Gururajan, P. Kumar, J. Weissmüller, A. K. Singh and N. Ravishankar, “Wrinkling of Atomic Planes in Ultrathin Au Nanowires" Nano Letters 14 (2014) 4859.
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32. A. Misra, P. Kumar, J. R. Raney, A. Singhal, L. Lattanzi and C. Daraio, “Effect of Fluid Medium on Mechanical Behavior of Carbon Nanotube Foam" Appl. Phys. Lett. 104 (2014) 221910.
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31. P. Kumar, J. Howarth and I. Dutta, “Electric Current Induced Flow of Liquid Metals: Mechanism and Substrate-Surface Effects" J. Appl. Phys. 115 (2014) 044915.
Link to paper

30. Z. Huang, P. Kumar, I. Dutta, R. Sidhu, M. Renavikar and R. Mahajan, "Effects of Microstructure and Loading on Fracture of Sn-3.8 Ag-0.7 Cu Joints on Cu Substrates with ENIG Surface Finish", J. Elect. Mater. 43 (2014) 4485.
Link to paper

29. Z, Huang, P. Kumar, I. Dutta, J. H. L. Pang and R. Sidhu, "A General Methodology for Calculating Mixed Mode Stress Intensity Factors and Fracture Toughness of Solder Joints with Interfacial Cracks", Engineering Fracture Mechanics 131 (2014) 9.
Link to paper

28. Z. Huang, P. Kumar, I. Dutta, R. Sidhu, M. Renavikar and R. Mahajan, “Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints" J. Elect. Mater. 43 (2014) 88. (Editors' choice for 2013, Freely available)
Link to paper

27. S. Talukder, P. Kumar and R. Pratap, “Electric Current-Induced Mass Flow in Very Thin Infinite Metallic Films" IEEE Trans. Elect. Dev. 60 (2013) 2877.
Link to paper

26. A. Misra and P. Kumar, “Periodic Architecture for High Performance Shock Absorbing Composites" Scientific reports 3 (2013) 2056.
Link to paper

25. P. Kumar and I. Dutta, “Effect of Substrate Surface on Electromigration-Induced Sliding at Hetero-Interfaces" J. Phys. D: Appl. Phys. 46 (2013) 155303.
Link to paper

24. P. Jagtap, P. Gowda, B. Das and P. Kumar, “Effect of Electro-Mechanical Coupling on Actuation Behavior of a Carbon Nanotube Cellular Structure" Carbon 60 (2013) 169.
Link to paper

23. S. Talukder, N. Somaiah and P. Kumar, “Effect of Substrate Surface Roughness on Electric Current Induced Flow of Liquid Metals" Appl. Phys. Lett. 102 (2013) 054101.
Link to paper

22. P. Kumar, A. Mishra, T. Watt, I. Dutta, D. L. Bourell and U. Sahaym, “Electromagnetic Jigsaw: Metal-Cutting by Combining Electromagnetic and Mechanical Forces" Procedia CIRP 6(2013) 601.
Link to paper

21. U. Sahaym, B. Talebanpour, S. Seekins, I. Dutta, P. Kumar and P. Borgesen, “Recrystallization and Ag3Sn Particle Redistribution During Thermomechanical Treatment of Bulk Sn-Ag-Cu Solder Alloys" IEEE Trans. Comp. Packag. Manuf. Technol. 3 (2013) 1868.
Link to paper

20. T. Mungole, N. Nadammal, K. Dawra, P. Kumar, M. Kawasaki and T. G. Langdon, “Evolution of Microhardness and Microstructure in a Cast Al–7% Si Alloy During High-Pressure Torsion" J. Mater. Sci. 48 (2013) 4671.
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19.  P. Kumar, I. Dutta and M. S. Bakir, "Deformation and Interfacial Effects during Thermal Cycling of Cu Filled Through-Silicon Vias (TSV)", J. Elec. Mater. 41 (2012) 322
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18.  Z. Huang, P. Kumar, I. Dutta, R. Sidhu, M. Renavikar and R. Mahajan, "Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates: I. Effects of Loading and Processing Conditions ", J. Elec. Mater. 41 (2012) 375
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17.  P. Kumar, Z. Huang, I. Dutta, R. Sidhu, M. Renavikar and R. Mahajan, "Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates. II: Fracture Mechanism Map", J. Elec. Mater. 41 (2012) 412
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16.  P. Kumar, Z. Huang, D. Chan, S.C.J. Chavali, I. Dutta, G. Subbarayan and V. Gupta, "A Microstructurally Adaptive Creep Model for a Sn-based Lead-Free Solder", IEEE Trans Comp. Packag. Manuf. Technol. 2 (2012) 256 (Best paper award 2012 - Components segment)
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15.  I. Dutta, P. Kumar and M. S. Bakir, "Interface-related Reliability Challenges in 3-D Interconnect Systems with Through-silicon Vias", J. Metals 63(10) (2012) 70
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14.  P. Kumar and T. G. Langdon "Mechanical Characteristics of Zn-22% Al and Al-3% Mg Alloys Processed to High Strains by ECAP", Mater. Sci. Forum 667-669 (2011) 695
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13.  J. Liu, P. Kumar, I. Dutta, R. Raj, M. Renavikar and Wakharkar, "Liquid Phase Sintered Composite Solders for Next Generation Thermal Interface Material and Interconnect Applications", J. Mater. Sci. 46 (2011) 7012
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12.  P. Kumar and I. Dutta, "Interaction between Electromigration and Diffusionally Accommodated Sliding at Hetero-Interfaces", Acta Mater 59(2011) 2096
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11.  I. Dutta and P. Kumar, "Electric Current Induced Liquid Metal Flow: Application to Coating of Micro-Patterned Structures", App. Phys. Lett. 94 (2009) 184104
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10.  I. Dutta, R. Raj, P. Kumar, T. Chen, C. M. Nagaraj, J. Liu, M. Renavikar and V. Wakharkar, "Liquid Phase Sintered Solders with Indium as Minority Phase for Next Generation Thermal Interface Material Applications", J. Elec. Mater. 38(2009) 2735
Link to Paper

9.  I. Dutta, P. Kumar and G. Subbarayan, "Microstructural Coarsening in Sn-Ag-based Solders and its Effects on Mechanical Properties" J. Metals 61 (06) (2009) 29
Link to Paper

8.  P. Kumar, C. Xu and T. G. Langdon, "Influence of Strain Rate on Strength and Ductility in an Aluminum Alloy Processed by ECAP", J. Mater. Sci. 44 (2009) 3913
Link to Paper

7.  P. Kumar, M. E. Kassner, W. Blum, P. Eisenlohr and T. G. Langdon, "New Observations on High Temperature Creep at Very Low Stresses" Mater. Sci. Eng. A 510-511(2009) 20
Link to Paper

6.  P. Kumar and M. E. Kassner, "Theory for Very Low Stress ("Harper - Dorn") Creep", Scripta Mater 60 (2009) 60
Link to Paper

5.  P. Kumar, M. E. Kassner and T. G. Langdon, "The role of Harper-Dorn creep at High Temperatures and Very Low Stresses", J. Mater. Sci. 42 (2008) 409
Link to Paper

4.   M. E. Kassner, P. Kumar and W. Blum, "Harper - Dorn Creep", Int. J. Plast. 23 (2007) 980
Link to Paper

3.   P. Kumar, M. E. Kassner and T. G. Langdon, "Fifty years of Harper–Dorn creep: a Viable Creep Mechanism or a Californian Artifact?" J. Mater. Sci. 42 (2007) 409
Link to Paper

2.   P. Kumar, C. Xu and T. G. Langdon, "Mechanical Characteristics of a Zn–22% Al Alloy Processed to Very High Strains by ECAP", Mater. Sci. Eng. 429A (2006) 324
Link to Paper

1.   P. Kumar, C. Xu and T. G. Langdon, "The Significance of Grain Boundary Sliding in the Superplastic Zn–22% Al Alloy After Processing by ECAP", Mater. Sci. Eng. 411 - 412A (2005) 447
Link to Paper


Conference Proceedings

27. D. Lal, A. Tripathi, A. Ghosh, R. Bathe, P. Kumar, and V. Jayaram, “Use of Compression-Bending Fracture Geometry to Study the Effects of Stoichiometry on Fracture Toughness of β-NiAl”, K. Jonnalagadda et al. (eds.), Advances in Structural Integrity, Lecture Notes in Mechanical Engineering (2022) 313
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26. P. Goel, P. Kumar, and V. Jayaram, “Extracting Strain Rate Sensitivity of Metals from a Single Cantilever Under Bending”, K. Jonnalagadda et al. (eds.), Advances in Structural Integrity, Lecture Notes in Mechanical Engineering (2022) 343.
Link to paper

25. S. Kumar, P. Kumar and R. Pratap, “Reliability Failure in Microelectronic Interconnects by Electric Current Induced Chemical Reaction” IOP Conf. Series: Materials Science and Engineering 1206 (2021) 012026
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24. M. Sharma, S. Kumar, R. Pratap, A. Irzhak, P. Kumar, S. von Gratowsky, V. Koledov, P. Lega and V. Shavrov, "Electric Current Driven Formation of Micro-and Nano-sized Beads in Thin Cr Films", IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO), 4-8 Aug. Zhenjiang, China (2019) 86
Link to paper

23. S. von Gratowski, Z. Wang, L. Li, Z. Song, A. Irzhak, P. Lega, A. Frolov, A. Orlov, V. Koledov, V. S. Nagaraja, G. Nithya and P. Kumar, "Study of the Sticking Effects during Mechanical Nano-manipulation Using Shape Memory Nanotools", IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO), 4-8 Aug. Zhenjiang, China (2019) 130
Link to paper

22. A. Irzhak, V. Koledov, T. Zhuravleva and P. Kumar, "Melting of Metal Nano Particles for Nanoassembling", IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO), 4-8 Aug. Zhenjiang, China (2019) 78
Link to paper

21. S. Kumar, E. Abraham, S. Talukder, P. Kumar and R. Pratap "Micro Electrolithography System Development", 2018 4th IEEE International Conference on Emerging Electronics (ICEE), 17-19 December, Bangalore (2018)
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20. P. Kumar, R. Pratap, S. Talukder, S. Kumar, V. Shashtri, R. Maurya and M. Swamy K. B. "Patterning Cr Film by Passing Electric Current Through a Traversing Pointy Stylus: Introduction to Electrolithography and Its Prospects", 2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO), 13-17 August, Hangzhou (2018) 181
Link to paper

19. P. Kumar, V. Koledov, S. von Gratowski, R. Pratap, A. Irzhak, A. Zhikharev, A. Orlov, P. Lega, S. Talukder, S. Kumar and V. Shashtri, "Electrical Jointing at Micro- and Nanoscale by Electromigration and Mechanical Nano-Manipulation for Bottom-Up Nano-Assembling", 2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO), 13-17 August, Hangzhou (2018) 167
Link to paper

18. N. Somaiah and P. Kumar, "Observation of Inverse Blech Length Effect during Electromigration of Cu Thin Film", Proc. 19th International Conference on Microelectronics and Microsystems Technology (ICMMT), Zurich Switzerland 19 (7 -Part XVII)(2017) 2142
Link to paper

17. P. Jagtap and P. Kumar, "Macro and Micro-Texture Study for Understanding Whisker Growth in Sn Coatings", IEEE Proc. EPTC (2016) 165
Link to paper

16. P. Jagtap and P. Kumar, "Understanding Whisker Growth: Effect of Substrate and Underlayer", Proc. of 49th International Microelectronics Assembly and Packaging Society (IMAPS) (2016) 000512
Link to paper

15. S. Talukder, P. Kumar and R. Pratap, “Nanoscale Patterning in Ambient Conditions using Liquid Electromigration”, Proc. SPIE 9777 (2016); doi:10.1117/12.2219024
Link to paper

14. S. P. Singh and P. Kumar, "Relationship between Exhaustion of Dislocation Density and Observation of Classical Harper-Dorn Creep in LiF Single Crystals", Conference proceedings, 7th International Conference on Creep, Fatigue and Creep-Fatigue Interaction, (2016) 213

13. I. Dutta, J. Liu, K. Mireles, P. Kumar and L. Meinshausen, "Interfacially Engineered Micro and Nano-Scale Cu-In Composites as High Performance Thermal Interface Materials for Advanced Electronics", IEEE Proc. EPTC (2014) 635
Link to paper

12.  B. Talebanpour, U. Sahaym, I. Dutta and P. Kumar, “Effect of Aging on Impression Creep Behavior of Pb-Free Solders" ASME - Proc. InterPACK (2013) V001T07A005.
Link to paper

11. Z. Chen, B. Talebanpour, Z. Hunag, P. Kumar and I. Dutta, “Effect of Processing on Microstructure and Fracture of Solder Microbumps in 3-D Packages" IEEE Proc. EPTC (2013) 534.
Link to paper

10. P. Kumar, B. Talenbanpour, U. Sahaym, C. H. Wen and I. Dutta, “Microstructural Evolution and Some Unusual Effects during Thermo-Mechanical Cycling Of Sn-Ag-Cu Alloys" IEEE - Proc. ITherm (2012) 880. (Best paper award)
Link to paper

9. S. Chavali, Y. Singh, P. Kumar, G. Subbarayan, I. Dutta and D. R. Edwards, “Aging Aware Constitutive Models for SnAgCu Solder Alloys”, IEEE - Proc. ECTC (2011) 701 (Intel best student paper award)
Link to Paper

8. J. Liu, P. Kumar, I. Dutta, C. M. Nagaraj, R. Raj, M. Renavikar and R. Mahajan, “Effect of Interfacial Layers on the Performance of Cu-In Liquid Phase Sintered Composites as Thermal Interface and Interconnect Materials”, ASME - Proc. InterPACK (2011) 773
Link to paper

7.  Z. Huang, P. Kumar, I. Dutta, J. H. L. Pang, R. Sidhu, M. Renavikar and R. Mahajan, "Fracture Mechanism Map for the Fracture of Microelectronic Pb-free Joints under Dynamic Loading Conditions", IEEE - Proc. EPTC (2010) 298 (Best paper award)
Link to Paper

6.  Z. Huang, P. Kumar, I. Dutta, G. Subbarayan, V. Gupta, D. Chan and C. H.Wen, "Development of a Microstructurally Adaptive Unified Primary cum Secondary Creep Model for SAC387 Solder Joints", IEEE - Proc. ITherm (2010) 1
Link to Paper

5.  J. Liu, P. Rottman, S. Dutta, P. Kumar, R. Raj, M. Renavikar and I. Dutta, "Next Generation Materials for Thermal Interface and High Density Energy Storage Applications via Liquid Phase Sintering", IEEE - Proc. EPTC (2009) 506
Link to Paper

4.  J. Liu, P. Kumar, I. Dutta, R. Raj, and M. Renavikar, "Next Generation Solder Systems for Thermal Interface and Interconnect Applications via Liquid Phase Sintering", ASME - Proc. InterPACK (2009) 385
Link to Paper

3.  P. Kumar, I. Dutta, V. Sarihan, D. R. Frear, S. Jadhav and M. Renavikar, "Effects of Strain Rate and Aging on Deformation and Fracture of Sn-Ag-Cu Solder Joints", IEEE - Proc. ITherm (2008) 660 (Best paper award - Mechanics track)
Link to Paper

2.  P. Kumar, I. Dutta, R. Raj, M. Renavikar and V. Wakharkar, "Novel Liquid Phase Sintered Solders with Indium as Minority Phase for Next Generation Thermal Interface Materials Applications", IEEE - Proc. ThETA 2 (2008) 339
Link to Paper

1.  P. Kumar, O. Cornejo, I. Dutta, G. Subbarayan and V. Gupta, "Joint Scale Dependence of Aging Kinetics in Sn-Ag-Cu Solders", IEEE - Proc. EPTC (2008) 903
Link to Paper