Research Interest
Mechanical behaviour of materials with emphasis on electric/ magnetic field and length-scale effects
Mechanics and materials related reliability issues in microelectronics packages
Electromigration and its constructive engineering applications
Education
Ph.D. Mechanical Engineering (Major: Materials, Minor: Design), University of Southern California, Los Angeles, CA (USA), 2007.
M.S. Mechanical Engineering (Mechanics and Materials), University of Southern California, Los Angeles, CA (USA), 2005.
B.Tech. Mechanical Engineering, Indian Institute of Technology, Kanpur (India), 2003
Professional Experience
May 2023 - date Professor, Indian Institute of Science, Bangalore, India
May 2017 - April 2023 Associate Professor, Indian Institute of Science, Bangalore, India
May 2011 - April 2017 Assistant Professor, Indian Institute of Science, Bangalore, India
September 2008 - April 2011 Research Assistant Professor, Washington State University, Pullman, WA, USA
September 2007 - August 2008 Research Associate, Naval Postgraduate School, Monterery, CA, USA.
January 2006 - January 2007 Visiting Scientist, University of Erlangen-Nuremberg, Erlangen, Germany.
August 2003 - August 2007 Graduate Assistant, University of Southern California, Los Angeles, CA, USA.
Awards and Recognition
Indian National Academy of Engineering (INAE): Abdul Kalam Technology Innovation National Fellowship 2022-2025
Indian National Academy of Engineering (INAE): Young Engineer Award 2017, INAE Young Associates
Advanced Powder Technology: Certificate for Editorial Excellence 2017
Acta Materialia: Outstanding Reviewer Award 2017
Professor Priti Shankar Teaching Award for Assistant Professors, IISc: 2016
Indian National Science Academy (INSA): Young Scientist 2016, Member INYAS
National Academy of Science, India (NASI): Young Scientist Platinum Jubilee Award 2016, Young Member 2016
Indian Academy of Science (IAS): Associate 2016-2019
Editor's choice journal papers: Jagtap and Kumar, J Elec Mater (2015); Huang et al, J Elec Mater (2014)
Best paper award for journal papers: IEEE - Comp. Packag. Technol. - 2012
Best paper award for conference papers: ITherm - 2008; IEEE-EPTC - 2010; ECTC - 2011; ITherm - 2012
Best poster award in international conferences: ICSMA -2012
Gandhian Young Technological Innovation Award, 2014
Dean's Fellowship, University of Southern California, Los Angeles - 2003 to 2006
Directors Notional Award, Indian Institute of Technology, Kanpur - 2001, 2002
Govinda and Srikantha Scholarship, IIT-Kanpur: 2002
National Talent Search Examination (NTSE) Scholarship, India: 1999 – 2002
Professional Society Membership
MRS, TMS, Indian Institute of Metals (IIM), Indian Science Congress Association
Editorial Role
Editor: Advanced Powder Technology: 2017 – 2022
Principle Editor: MRS Advances: 2019 – present
Editor: Transactions of Indian Institute of Metals (Trans IIM): 2023 – present
Guest Editorial Role
Guest Editor: Journal of Materials Science, Special issue on "Processing bulk nanostructured materials", 2024 (M. Kawasaki and P. Kumar)
Guest Editor: Journal of Electronic Materials, Speical issue on "Electronic packaging and interconnection" 2024 (C. M. Gourlay, P. Kumar and M. A. A. Salleh)
Services
Chair, Office of International Relations, Indian Institute of Science, Bangalore Feb 2021-July 2022
Member, Department Course Curriculum Committee, Department of Materials Engineering, Indian Institute of Science, Bangalore 2017- date
Patents
1. S. Talukder, R. Pratap and P. Kumar, “A device, system and method generating structures on a substrate by electromigration”, Indian Patent No. 441916.
2. S. Kumar, R. Pratap and P. Kumar, “An electrochemical lithography tool for high throughput pattern generation”, Indian Patent No. 518880.
3. S. I. A. Jalali, V. Jayaram and P. Kumar, “A system and method for determination of power law creep parameters from a single bending specimen", Indian Patent No. 520344.
4. S. A. Misra, P. Kumar and Krishnakumar V. P., “A non-invasive testing device for measuring medical parameters and a method of manufacturing thereof", Indian Patent, Application No. 202341012320 (Date: 23/02/2023).
Publications
Editorials
1. M. Kawasaki and P Kumar, “Preface to the special issue: Processing bulk nanostructured materials”, J Mater Sci (2024) - available online.
Book Chapter
1. P. Kumar, Z. Huang, I. Dutta, G. Subbarayan and R. Mahajan, "Microstructural Effects on Creep and Fracture Toughness of Sn-Ag-Cu Solder Joints", Chapter 8 in Lead-free Solders: Materials Reliability for Electronics, edited by K. N. Subramanian, Wiley series in Electronic and Optoelectronic Materials, John Wiley, 2012
2. P. Kumar, I. Dutta, Z. Hunag and P. Conway, "Materials and Processing of TSV", Chapter 3 in 3D Microelectronic Packaging: From Fundamentals to Applications Edited by Yan Li and Deepak Goyal, Springer Series in Advanced Microelectronics, 2017
3. P. Kumar, I. Dutta, Z. Hunag and P. Conway, "Microstructural and Reliability Issues of TSV", Chapter 4 in 3D Microelectronic Packaging: From Fundamentals to Applications, Edited by Yan Li and Deepak Goyal, Springer Series in Advanced Microelectronics, 2017
4. P. Kumar, "Electromigration in Metallic Materials and Its Role in Whiskering", Chapter 5 in Handbook of Solid State Diffusion: Volume 2, Diffusion Analysis in Material Applications, Edited by Aloke Paul and Sergiy Divinski, Elsevier, 2017
Journals
135. L Upadhayay, S Nilawar, C Kumar, K Chatterjee and P Kumar, “Effect of processing Mg–6Zn–0.2 Ce through high-pressure torsion on its use as a biomaterial”, J Mater Sci (2024) - available online.
134. S Telpande, S Jain, P Kumar, “Effect of external magnetic field on electric current-induced fracture of notched thin metallic conductors: Part 2-High magnetic fields”, Theoretical and Applied Fracture Mechanics 130 (2024) 104294.
133. S Telpande, S Jain, P Kumar, “Effect of external magnetic field on electric current-induced fracture of notched thin metallic conductors: Part 1–Low magnetic fields”, Theoretical and Applied Fracture Mechanics 130 (2024) 104301.
132. C. Kumar and P. Kumar, “Analyzing dynamic strain aging and yield strength anomaly in IN740H, a nickel-based superalloy comprising low volume fraction of γ′”, Materialia 33 (2024) 102028.
131. S.I.A. Jalali, S. Bhowmick, V. Jayaram and P. Kumar, “Sample size effect on creep in bending: An interplay between strain gradient and surface proximity effects”, J Mater Res 38 (2023) 3059.
130. A. Kulkarni, D. Srinivasan, P. Ravanappa, V. Jayaram and P. Kumar, “Creep behavior of additively manufactured high strength A205 aluminum alloy”, Additive Manufacturing Letters 6 (2023) 100142.
129. S Kumar, A. Mukherjee, S. Telpande, A. D. Mahapatra, P. Kumar and A. Misra, “Role of the electrode-edge in optically sensitive three-dimensional carbon foam-MoS2 based high-performance micro-supercapacitors”, J. Mater. Chem. A 11 (2023)4963.
128. P. Jagtap and P. Kumar, “Effect of electric field on mechanical behavior of vertically-aligned carbon nanotube structures”, Proceedings of the Indian National Science Academy 86 (2023) 254.
127. D. Singh, D. Srinivasan, A. Ghosh, V. Jayaram and P. Kumar, “Creep Life Assessment of In-Service Components by Testing Sub-Standard Sized Samples in Bending: An Example Case of X22CrMoV12-1 Ferritic Steel Used in Steam Turbines”, Transactions of the Indian National Academy of Engineering 8 (2023) 449.
126. F. Hijazi, B. Roy, D. Srinivasan, V. Jayaram and P. Kumar, “Non-Uniform Mechanical Behaviour of Uniaxially Rolled Ti-6Al-4V with Micro Texture Regions”, Mater. Sci. Eng. A 869 (2023) 144813.
125. A. Kanjilal, P. Ramesh Narayanan, M. Agilan and P Kumar, “Effect of Joint Size on Creep Behavior of Sn-Ag-Cu Solder-Cu Joints”, J. Elec. Mater. 52(2023)739.
124. A. Kulkarni, D. Srinivasan, S. Kumar, P. Kumar and V. Jayaram, “Precipitate evolution and thermal stability of A205 fabricated using laser powder bed fusion”, J. Mater. Sci. 58 (2023) 2310.
123. P. Goel, P. Kumar and V. Jayaram, “Estimation of stress redistribution for the extraction of power law creep parameters from bending”, Mechanics of Materials, 177 (2023) 104518.
122. V. Shastri, S. Majumder, A. Ashok, K. Roy, R. Pratap and P Kumar, “Electric current-assisted manipulation of liquid metals using a stylus at micro-and nano-scales”, Nanotechnology 34 (2022) 105301.
121. S. P.Singh, V. Jayaram, D. Srinivasan and P. Kumar, “High Throughput Determination of Creep Behavior of Additively Manufactured AlSi10Mg Alloy”, 58 (2022) 103049.
120. V. Shastri, S. Talukder, K. Roy, P. Kumar and R. Pratap, “Manipulating liquid metal flow for creating standalone structures with micro-and nano-scale features in single step”, Nanotechnology 33 (2022) 455301.
119. M. E. Kassner, T. Oros and P. Kumar, “Comments on the Mechanism of Detachment in Creep of Dispersion Strengthened Alloys at High Temperatures”, Metals 12 (2022) 1191.
118. S. P.Singh, A. Rijal, T. Straub, J-K. Han, T. Kennerknecht, C. Eberl, M. Kawasaki and P. Kumar, “Effect of high-pressure torsion on high cycle fatigue of commercially pure Cu: Some insights from formation of surface micro-cracks”, Mater. Characterization 20 (2022) 112059.
117. D. Lal. V. Ramanadham, P. Kumar, S. Sampath and V. Jayaram, “Damage accumulation in plasma-sprayed zirconia undercyclic loading”, J Am Ceram Soc. 105 (2022) 5883.
116. A. Kanjilal, Ramesh Narayanan P and P. Kumar, “Transition from necking to cavitation driven tertiary creep with length scale in constrained ductile metal joints”, Mater. Sci. Eng. 845A (2022) 143205.
115. V. Shastri, S. talukder, K. Roy, P. Kumar and R. Pratap, “Spontaneous Formation of Structures with Micro- and Nano-Scopic Periodic Ripple Patterns”, ACS Omega 7 (2022) 12111
114. F. Hijazi, D. Srinivasan, B. Roy, P. Kumar and V. Jayaram, “Micro-texture regions in rolled Ti-6Al-4V under polarized light”, Scripta Materialia 213 (2022) 114588.
113. A Kanjilal and P Kumar, “Size Dependent Creep Deformation of Elastically Constrained Compliant Metallic Joints”, Materialia 21 (2022) 101322.
112. S. Kumar, E. Abraham, P. Kumar, R. Pratap, “Introducing Water Electrolithography”, ACS Omega 6 (2021) 25692.
111. T. Baskaran, N. Esakkiraja, C. Samartha, P. Kumar, V. Jayaram, A. Paul, “Effect of addition of Pt, Pd and Ir to β-NiAl-bond coat on oxidation resistance and growth of interdiffusion zone”, Surf. Coat. Technol. 426 (2021) 127766.
110. R. Sunder, D. Raut, V. Jayaram, P. Kumar and V. Shashtri “Near-tip residual stress as an independent load interaction mechanism”, Int. J. Fatigue 151 (2021) 106364.
109. D. Lal, P. Kumar, R. Bathe, S. Sampath and V. Jayaram, “Effect of microstructure on fracture behavior of freestanding plasma sprayed 7 wt.% Y2O3 stabilized ZrO2”, J. Euro. Ceram. Soc. 41 (2021) 4294.
108. D. Sonawane and P. Kumar, “Stability of Cu-islands Formed on Si Substrate via “Dewetting” under Subsequent Thermal Cycling”, Nanotechnology 32 (2021) 195703.
107. P. Jagtap and P. Kumar, "Whisker Growth in Sn Coatings: A Review of Current Status and Future Prospects”, J. Elec. Mater. 50 (2021) 735.
106. D. Sonawane and P. Kumar, “Role of Grain Boundary Sliding in Structural Integrity of Cu-Filled Through Si Via During Isothermal Annealing”, J. Elec. Mater. 50 (2021) 767.
105. S. I. A. Jalali, V. Jayarm and P. Kumar "Creep Micromechanics in Meso-Length Scale Samples”, Acta Mater. 205 (2021) 116535.
104. S. I. A. Jalali, P. Kumar and V. Jayaram, "Customized High-Temperature Bending with DIC for High-Throughput Determination of Creep Parameters: Technique, Instrumentation, and Optimization”, J. Metal. (JOM) 72 (2020) 4522.
103. S. Kumar, H. Suresh, V. A. Sethuraman, P. Kumar and R. Pratap, “Electric field induced patterning in Cr film under ambient conditions: A chemical reaction based perspective”, SN App. Sci. 2 (2020) 2073.
102. S. P. Singh, P. Kumar and M. E. Kassner, “Frustration of the dislocation density in NaCl and its implication on “Harper-Dorn” creep”, Mater. Sci. Eng. 799 (2020) 140360.
101. D. Sonawane and P. Kumar, “New Insights into Fracture of Si in Cu-Filled Through Silicon Via during and after Thermal Annealing”, Engineering Fracture Mechanics 238 (2020) 107281
100. S. Kumar, S. Telpande, V. Manikandan, P. Kumar and A. Misra, “Novel Electrode Geometry for High Performance CF/Fe2O3 based Planar Solid State Micro-electrochemical Capacitor”, Nanoscale 12 (2020) 19438.
99. S. P. Singh, P. Kumar and M. E. Kassner, “The low-stress and high-temperature creep in LiF single crystals: An explanation for the So-called Harper-Dorn creep”, Materialia 13 (2020) 100864. Winner of Acta Student Award 2020)
98. D. Sonawane, A. Choudhury and P. Kumar, “New Insights into Dewetting of Cu Thin Films Deposited on Si”, Langmuir 36 (2020) 5534
97. D. Lal, P. Kumar, S. Sampath and V. Jayaram, “Hysteretic and Time Dependent Deformation of Plasma Sprayed Zirconia Ceramics”, Acta Mater 194 (2020) 394
96. R. Ghosh, S. Telpande, P. Gowda, S. K. Reddy, P. Kumar and A. Misra, “Deterministic Role of Carbon Nanotube-Substrate Coupling for Ultrahigh Actuation in Bilayer Electrothermal Actuators”, ACS Appl Mater Interfaces 12 (2020) 26.
95. M. Sharma, P. Kumar, A. V. Irzhak, S. Kumar, R. Pratap, S. V. von Gratovski, V. G. Shavrov and V. V. Koledov, “Melting and Electromigration in Thin Chromium Films”, Phys. Solid State 62 (2020)988
94. N. Somaiah, A. Kanjilal and P. Kumar, “Effects of an interfacial layer on stress relaxation mechanisms active in the Cu–Si thin film system during thermal cycling”, MRS Communications 10 (2020) 164.
93. S. I. A. Jalali, P. Kumar and V. Jayaram, “Microstructural equivalence between bending and uniaxial creep”, Scripta Mater 186 (2020) 99.
92. P. Tan, P. Kumar and I. Dutta, “A cutting mechanism map for machining metallic sheets using electric current pulses”, Eng Res Exp 2 (2020) 025035
91. D. Sharma, I. Dutta and P. Kumar, “A technique for machining thin metallic foils using electromagnetic-mechanical pulsed loading”, Eng. Res. Exp. 2 (2020) 015031.
90. S. I. A. Jalali, P. Kumar and V. Jayaram, “High Throughput Determination of Creep Parameters Using Cantilever Bending: Part II - Primary and Steady-State through Uniaxial Equivalency”, J. Mater. Res. 35 (2020) 362.
89. S. I. A. Jalali, P. Kumar and V. Jayaram, “High Throughput Determination of Creep Parameters Using Cantilever Bending: Part I - Steady-State”, J. Mater. Res. 35 (2020) 353.
88. A. Rijal, S. P. Singh, J. K. Han, M. Kawasaki and P. Kumar, “Effect of High-Pressure Torsion on Hardness and Electrical Resistivity of Commercially Pure Cu”, Advanced Engineering Materials 22 (2020) 1900547
87. D. Lal, P. Kumar, S. Sampath and V. Jayaram “Low-temperature stiffening of air plasma-sprayed 7 wt% Y2O3-stabilized ZrO2”, J. Am. Ceram. Soc. 103 (2020) 2076.
86. N. Somaiah and P. Kumar, “Effect of Thermomigration-Electromigration Coupling on Mass Transport in Cu Thin Films”, J. Elec. Mater. 49 (2020) 96.
85. D. S. Sonwane, P. C. Ramamurthy and P. Kumar, “Mechanical Reliability of Photovoltaic Cells under Cyclic Thermal Loading”, J. Elec. Mater. 49 (2020) 59.
84. A. Rijal, S.P. Singh, J. Han, M. Kawasaki and P. Kumar, “Effect of HPT processing followed by long term natural ageing on mechanical and electrical properties of commercially pure Cu”, Lett. Mater. 9 (2019) 561.
83. N. Somaiah and P. Kumar, “Tuning Sample Length Effect on Mass Transport in Current Carrying Cu-Si Thin Film Systems via Interfacial Engineering”, Nanotechnology 30 (2019) 485704.
82. S. P. Singh, X-R. Huang, P. Kumar and M. E. Kassner, “Short Communication: Assessment of the Dislocation Density Using X-ray Topography in Al Single Crystals Annealed for Long Times Near the Melting Temperature”, Materials Today: Communications 21 (2019) 100613.
81. S. Talukder, B. Gogoi, P. Kumar, R. Pratap, R. Maoz and J. Sagiv, “Advanced Nanopatterning Using Scanning Probe Technology”, Materials Today: Proceedings 18 (2019) 740
80. S. I. A. Jalali, P. Kumar and V. Jayaram, “Creep of Metallic Materials in Bending”, JOM JOM 71 (10) (2019) 3565.
79. F. Hijazi, J. Kar, A. H. V. Pavan, K. Singh, P. Kumar and V. Jayaram, “Application of Bending Creep for Examining Effect of Service Conditions on Creep Response of Steel”, Mater. Sci. Eng. 766 A (2019) 138398
78. S. P. Singh, D. Sonawane and P. Kumar, “Creep of Cu-Bi Alloys with High Bi Content Near and Above Melting Temperature of Bi”, Metall. Mater. Trans. A50 (2019) 2690.
77. D. Sharma and P. Kumar, “Failure of thin metallic conductors under electric current loading: Transition from sharp crack to blow-hole”, Eng. Fracture Mech. 208 (2019) 221.
76. N. Somaiah and P. Kumar, “Inverse Blech Length Phenomenon in Thin-Film Stripes”, Phys. Rev. Applied 10 (2018) 054052.
75. N. Somaiah and P. Kumar, “Tuning electromigration-thermomigration coupling in Cu/W Blech structures”, J. Appl. Phys. 124 (2018) 185102.
74. D. Sharma, B. Subba Reddy and P. Kumar, “Fracture of pre-cracked metallic conductors under combined electric current and mechanical loading”, Int. J. Fracture 212 (2018) 167.
73. D. Sharma, B. Subba Reddy and P. Kumar, “Fracture of pre-cracked thin metallic conductors due to electric current induced electromagnetic force”, Int. J. Fracture 212 (2018) 183.
72. P. Jagtap, R. Narayanan P., and P. Kumar, “Effect of Substrate Composition on Whisker Growth in Sn Coatings”, J. Elec. Mater. 47 (2018) 4177.
71. P. Jagtap, V. Sethuraman, and P. Kumar, “Critical Evaluation of Relative Importance of Stress and Stress Gradient in Whisker Growth in Sn Coatings”, J. Elec. Mater. 47 (2018) 5229.
70. D. Sharma, A. Jain, N. Somaiah, R. Narayanan P., and P. Kumar, “Effect of Embedding Cu-Graphene Hybrid Powder into 2-Phase In-Cu Solders on Its Suitability as Metallic Thermal Interface Material”, J. Elec. Mater. 47 (2018) 4863.
69. S. Chakraborty, P. Kumar and A. Choudhury, “Phase-Field Modeling of Grain-Boundary Grooving and Migration under Electric Current and Thermal Gradient”, Acta Mater 153 (2018) 377.
68. V. A. Baheti, S. Kashyap, P. Kumar, K. Chattopadhyay and A. Paul, “Solid state diffusion–controlled growth of the phases in the Au–Sn system”, Phil. Mag. 98 (2018) 20.
67. A. Kanjilal and P. Kumar, “Growth of Interfacial Intermetallic Compound Layer in Diffusion-Bonded SAC–Cu Solder Joints During Different Types of Thermomechanical Excursion ”, J. Elec. Mater. J. Elec. Mater. 47 (2018) 457.
66. V. A. Baheti, P. Kumar and A. Paul, “Growth of phases in the solid-state from room temperature to an elevated temperature in the Pd–Sn and the Pt–Sn systems ”, J. Mater. Sci.: Mater. Electronics 28 (2017) 18379.
65. V. A. Baheti, P. Kumar and A. Paul, “Effect of Au, Pd and Pt addition in Cu on the growth of intermetallic compounds and the Kirkendall voids in the Cu-Sn system”, J. Mater. Sci.: Mater. Electronics 28 (2017) 17014
64. S. Kumar, P. Kumar and R. Pratap, “A Model for Electromigration Induced Flow in Liquid Metals”, J. Phys. D: Applied Physics 50 (2017) 39LT02.
63. V. A. Baheti, S. Kashyap, P. Kumar, K. Chattopadhyay and A. Paul, “Solid–state diffusion–controlled growth of the intermediate phases from room temperature to an elevated temperature in the Cu–Sn and the Ni–Sn systems”, J. Alloy Compounds 727(2017) 832.
62. K. Smith, M. E. Kassner and P. Kumar, “Long-term Annealing of High Purity Aluminum Single Crystals: New Insights into Harper-Dorn Creep”, Mater Sci Eng A 705(2017) 1.
61. A. Kanjilal, V. Jangid and P. Kumar, “Critical Evaluation of Creep Behavior of Sn-Ag-Cu Solder Alloys over Wide Range of Temperatures”, Mater Sci Eng A 703(2017) 144.
60. P. Jagtap, A. Chakraborty, P. Eisenlohr and P. Kumar, “Identification of whisker grain in Sn coatings by analyzing crystallographic micro-texture using electron back-scatter diffraction”, Acta Mater 134 (2017) 346.
59. R. Ghosh, A. Kanjilal and P. Kumar, “Effect of type of thermo-mechanical excursion on growth of interfacial intermetallic compounds in Cu/Sn-Ag-Cu solder joints”, Microelectronic Reliability 74 (2017) 44.
58. V. A. Baheti, S. Kashyap, P. Kumar, K. Chattopadhyay and A. Paul, “Bifurcation of the Kirkendall marker plane and the role of Ni and other impurities on the growth of Kirkendall voids in the Cu-Sn system”, Acta Mater 131 (2017) 260.
57. V. A. Baheti, S. Kashyap, P. Kumar, K. Chattopadhyay and A. Paul, “Effect of Ni on growth kinetics, microstructural evolution and crystal structure in the Cu(Ni)–Sn system”, Phil. Mag. 97 (2017) 1782.( Winner of James Clerk Maxwell Prize 2017)
56. M. Kawasaki, B. Ahn, P. Kumar, J.-I. Jang, T. G. Langdon , “Nano- and Micro-mechanical Properties of Ultrafine-Grained Materials Processed by Severe Plastic Deformation Techniques”, Adv. Eng. Mater. 19 (2017) 1600578.
55. P. Kumar, M. Kawasaki and T. G. Langdon, “Resolving the Strength-Ductility Paradox through Severe Plastic Deformation of a Cast Al-7Si Alloy”, Mater. Sci. Forum 879 (2017) 1043.
54. S. P. Singh, B. K. Deb Barman and P Kumar, “Cu-Bi alloys with high volume fraction of Bi: A material potentially suitable for thermal surge protection and energy storage”, Mater. Sci. Eng. 677A (2016) 140.
53. D. Sonawane, S. Oberoi and P. Kumar, "Effect of Aspect Ratio of Test Specimens on Quasistatic Compression Loading and Stress-Relaxation of PDMS and a Cu-Filled-PDMS Composite", Polymer Testing 55(2016)173.
52. P. Jagtap, A. Kumar and P. Kumar, "Effect of Electric Field on Creep and Stress-relaxation Behavior of Carbon Nanotube Forests", RSC Adv 6(2016)67685.
51. B. K. Deb Barman, S. P. Singh and P Kumar, “Processing and Mechanical Behavior of Cu-Bi Alloys with High Volume Fraction of Bi: Suitability for High Temperature Soldering Application”, Mater. Sci. Eng. 666A (2016) 339.
50. N. Somaiah, D. Sharma and P. Kumar, “Electric current induced forward and anomalous backward mass transport”, J. Phys. D. 49 (2016) 20LT01.
49. S. Oberoi, D. Sonawane and P Kumar "Effect of Strain Rate and Filler Size on Mechanical Behavior of a Cu Filled Elastomer Based Composite", Comp. Sci. Technol. 127(2016) 185.
48. D. Sharma, R. K. Tiwari, R. Sharma, P. R. Narayanan and P Kumar "Two-Phase Metallic Thermal Interface Materials Processed Through Liquid Phase Sintering Followed by Accumulative Roll Bonding", IEEE Trans. Comp. Packag. Technol 6(2016)58.
47. V. A. Baheti, S. Islam, P. Kumar, R. Ravi, R. Narayanan, D. Hongqun, V. Vuorinen, T. Laurila and A. Paul "Effect of Ni content on the diffusion-controlled growth of the product phases in the Cu(Ni)–Sn system", Phil. Mag. 96(2016)15.
46. P. Kumar, M. Kawasaki and T. G. Langdon "Review- Overcoming the Paradox of Strength and Ductility in Ultrafine-Grained Materials at Low Temperatures", J. Mater. Sci. 51(2016)7. (First Paper in 50th Anniversary Issue)
45. S. Talukder, P. Kumar and R. Pratap,"Electrolithography- A New and Versatile Process for Nano Patterning", Scientific Reports 5 (2015) Art # 17753 . (Selected as show case article amongst 74 articles published on 4th Dec,2015)
44. P. Jagtap, S. K. Reddy, D. Sharma and P. Kumar, “Tailoring Energy Absorption Capacity of Carbon Nanotube Foams through Application of Electric Field”, Carbon 95 (2015), 126.
43. S. K. Reddy, D. Lal, A. Misra and P. Kumar,"Novel Architecture for Anomalous Strengthening of a Particulate Filled Polymer Matrix Composite", RSC Adv. 5 (2015) 62477.
42. S. Talukder, P. Kumar and R. Pratap,"Controlled Material Transport and Multidimensional Patterning at Small Length Scales using Electromigration", Current Science 108 (2015) 2167. (Cover page illustration)
41. T. Mungole, P. Kumar, M. Kawasaki and T. G. Langdon, "The Contribution of Grain Boundary Sliding in Tensile Deformation of an Ultrafine-Grained Aluminum Alloy having High Strength and High Ductility", J. Mater. Sci. 50 (2015) 3549.
40. P. Jagtap and P. Kumar, "Manipulating Crystallographic Texture of Sn Coatings by Optimization of Electrodeposition Process Conditions to Suppress Growth of Whiskers", J. Elec. Mater. 44 (2015) 1206. (Editor's choice, freely available)
39. P. Jagtap and P. Kumar, "Evaluating Shock Absorption Behavior of Small-Sized Systems under Programmable Electric Field", Review of Scientific Instruments 85 (2014) 113903.
38. A. Misra and P. Kumar, "Tailoring Viscoelastic Response of Carbon Nanotubes Cellular Structure Using Electric Field", Nanoscale 6 (2014) 13668.
37. T. Mungole, P. Kumar, M. Kawasaki and T. G. Langdon, "A Critical Examination of the Paradox of Strength and Ductility in Ultrafine-Grained Metals", J. Mater. Res. 29 (2014) 2534.
36. S. Talukder, P. Kumar and R. Pratap, “Film Thickness Mediated Transition in the Kinetics of Electric Current Induced Flow of Thin Liquid Metal Films" Appl. Phys. Lett. 104 (2014) 214102.
35. P. Kumar and S. Awasthi, “Mechanical and Thermal Modeling of In-Cu Composites for Thermal Interface Materials Applications" J. Comp. Mater. 48 (2014) 1391.
34. P. Gowda, P. Kumar, R. Tripathi and A. Misra, “Electric field induced ultra-high actuation in a bulk carbon nanotube structure" Carbon 67 (2014) 546.
33. A. Roy, S. Kundu, K. Müller, A. Rosenauer, S. Singh, P. Pant, M. P. Gururajan, P. Kumar, J. Weissmüller, A. K. Singh and N. Ravishankar, “Wrinkling of Atomic Planes in Ultrathin Au Nanowires" Nano Letters 14 (2014) 4859.
32. A. Misra, P. Kumar, J. R. Raney, A. Singhal, L. Lattanzi and C. Daraio, “Effect of Fluid Medium on Mechanical Behavior of Carbon Nanotube Foam" Appl. Phys. Lett. 104 (2014) 221910.
31. P. Kumar, J. Howarth and I. Dutta, “Electric Current Induced Flow of Liquid Metals: Mechanism and Substrate-Surface Effects" J. Appl. Phys. 115 (2014) 044915.
30. Z. Huang, P. Kumar, I. Dutta, R. Sidhu, M. Renavikar and R. Mahajan, "Effects of Microstructure and Loading on Fracture of Sn-3.8 Ag-0.7 Cu Joints on Cu Substrates with ENIG Surface Finish", J. Elect. Mater. 43 (2014) 4485.
29. Z, Huang, P. Kumar, I. Dutta, J. H. L. Pang and R. Sidhu, "A General Methodology for Calculating Mixed Mode Stress Intensity Factors and Fracture Toughness of Solder Joints with Interfacial Cracks", Engineering Fracture Mechanics 131 (2014) 9.
28. Z. Huang, P. Kumar, I. Dutta, R. Sidhu, M. Renavikar and R. Mahajan, “Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints" J. Elect. Mater. 43 (2014) 88. (Editors' choice for 2013, Freely available)
27. S. Talukder, P. Kumar and R. Pratap, “Electric Current-Induced Mass Flow in Very Thin Infinite Metallic Films" IEEE Trans. Elect. Dev. 60 (2013) 2877.
26. A. Misra and P. Kumar, “Periodic Architecture for High Performance Shock Absorbing Composites" Scientific reports 3 (2013) 2056.
25. P. Kumar and I. Dutta, “Effect of Substrate Surface on Electromigration-Induced Sliding at Hetero-Interfaces" J. Phys. D: Appl. Phys. 46 (2013) 155303.
24. P. Jagtap, P. Gowda, B. Das and P. Kumar, “Effect of Electro-Mechanical Coupling on Actuation Behavior of a Carbon Nanotube Cellular Structure" Carbon 60 (2013) 169.
23. S. Talukder, N. Somaiah and P. Kumar, “Effect of Substrate Surface Roughness on Electric Current Induced Flow of Liquid Metals" Appl. Phys. Lett. 102 (2013) 054101.
22. P. Kumar, A. Mishra, T. Watt, I. Dutta, D. L. Bourell and U. Sahaym, “Electromagnetic Jigsaw: Metal-Cutting by Combining Electromagnetic and Mechanical Forces" Procedia CIRP 6(2013) 601.
21. U. Sahaym, B. Talebanpour, S. Seekins, I. Dutta, P. Kumar and P. Borgesen, “Recrystallization and Ag3Sn Particle Redistribution During Thermomechanical Treatment of Bulk Sn-Ag-Cu Solder Alloys" IEEE Trans. Comp. Packag. Manuf. Technol. 3 (2013) 1868.
20. T. Mungole, N. Nadammal, K. Dawra, P. Kumar, M. Kawasaki and T. G. Langdon, “Evolution of Microhardness and Microstructure in a Cast Al–7% Si Alloy During High-Pressure Torsion" J. Mater. Sci. 48 (2013) 4671.
19. P. Kumar, I. Dutta and M. S. Bakir, "Deformation and Interfacial Effects during Thermal Cycling of Cu Filled Through-Silicon Vias (TSV)", J. Elec. Mater. 41 (2012) 322
18. Z. Huang, P. Kumar, I. Dutta, R. Sidhu, M. Renavikar and R. Mahajan, "Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates: I. Effects of Loading and Processing Conditions ", J. Elec. Mater. 41 (2012) 375
17. P. Kumar, Z. Huang, I. Dutta, R. Sidhu, M. Renavikar and R. Mahajan, "Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates. II: Fracture Mechanism Map", J. Elec. Mater. 41 (2012) 412
16. P. Kumar, Z. Huang, D. Chan, S.C.J. Chavali, I. Dutta, G. Subbarayan and V. Gupta, "A Microstructurally Adaptive Creep Model for a Sn-based Lead-Free Solder", IEEE Trans Comp. Packag. Manuf. Technol. 2 (2012) 256 (Best paper award 2012 - Components segment)
15. I. Dutta, P. Kumar and M. S. Bakir, "Interface-related Reliability Challenges in 3-D Interconnect Systems with Through-silicon Vias", J. Metals 63(10) (2012) 70
14. P. Kumar and T. G. Langdon "Mechanical Characteristics of Zn-22% Al and Al-3% Mg Alloys Processed to High Strains by ECAP", Mater. Sci. Forum 667-669 (2011) 695
13. J. Liu, P. Kumar, I. Dutta, R. Raj, M. Renavikar and Wakharkar, "Liquid Phase Sintered Composite Solders for Next Generation Thermal Interface Material and Interconnect Applications", J. Mater. Sci. 46 (2011) 7012
12. P. Kumar and I. Dutta, "Interaction between Electromigration and Diffusionally Accommodated Sliding at Hetero-Interfaces", Acta Mater 59(2011) 2096
11. I. Dutta and P. Kumar, "Electric Current Induced Liquid Metal Flow: Application to Coating of Micro-Patterned Structures", App. Phys. Lett. 94 (2009) 184104
10. I. Dutta, R. Raj, P. Kumar, T. Chen, C. M. Nagaraj, J. Liu, M. Renavikar and V. Wakharkar, "Liquid Phase Sintered Solders with Indium as Minority Phase for Next Generation Thermal Interface Material Applications", J. Elec. Mater. 38(2009) 2735
9. I. Dutta, P. Kumar and G. Subbarayan, "Microstructural Coarsening in Sn-Ag-based Solders and its Effects on Mechanical Properties" J. Metals 61 (06) (2009) 29
8. P. Kumar, C. Xu and T. G. Langdon, "Influence of Strain Rate on Strength and Ductility in an Aluminum Alloy Processed by ECAP", J. Mater. Sci. 44 (2009) 3913
7. P. Kumar, M. E. Kassner, W. Blum, P. Eisenlohr and T. G. Langdon, "New Observations on High Temperature Creep at Very Low Stresses" Mater. Sci. Eng. A 510-511(2009) 20
6. P. Kumar and M. E. Kassner, "Theory for Very Low Stress ("Harper - Dorn") Creep", Scripta Mater 60 (2009) 60
5. P. Kumar, M. E. Kassner and T. G. Langdon, "The role of Harper-Dorn creep at High Temperatures and Very Low Stresses", J. Mater. Sci. 42 (2008) 409
4. M. E. Kassner, P. Kumar and W. Blum, "Harper - Dorn Creep", Int. J. Plast. 23 (2007) 980
3. P. Kumar, M. E. Kassner and T. G. Langdon, "Fifty years of Harper–Dorn creep: a Viable Creep Mechanism or a Californian Artifact?" J. Mater. Sci. 42 (2007) 409
2. P. Kumar, C. Xu and T. G. Langdon, "Mechanical Characteristics of a Zn–22% Al Alloy Processed to Very High Strains by ECAP", Mater. Sci. Eng. 429A (2006) 324
1. P. Kumar, C. Xu and T. G. Langdon, "The Significance of Grain Boundary Sliding in the Superplastic Zn–22% Al Alloy After Processing by ECAP", Mater. Sci. Eng. 411 - 412A (2005) 447
Conference Proceedings
27. D. Lal, A. Tripathi, A. Ghosh, R. Bathe, P. Kumar, and V. Jayaram, “Use of Compression-Bending Fracture Geometry to Study the Effects of Stoichiometry on Fracture Toughness of β-NiAl”, K. Jonnalagadda et al. (eds.), Advances in Structural Integrity, Lecture Notes in Mechanical Engineering (2022) 313.
26. . Goel, P. Kumar, and V. Jayaram, “Extracting Strain Rate Sensitivity of Metals from a Single Cantilever Under Bending”, K. Jonnalagadda et al. (eds.), Advances in Structural Integrity, Lecture Notes in Mechanical Engineering (2022) 343.
25. S. Kumar, P. Kumar and R. Pratap, “Reliability Failure in Microelectronic Interconnects by Electric Current Induced Chemical Reaction” IOP Conf. Series: Materials Science and Engineering 1206 (2021) 012026
24. M. Sharma, S. Kumar, R. Pratap, A. Irzhak, P. Kumar, S. von Gratowsky, V. Koledov, P. Lega and V. Shavrov, "Electric Current Driven Formation of Micro-and Nano-sized Beads in Thin Cr Films", IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO), 4-8 Aug. Zhenjiang, China (2019) 86
23. S. von Gratowski, Z. Wang, L. Li, Z. Song, A. Irzhak, P. Lega, A. Frolov, A. Orlov, V. Koledov, V. S. Nagaraja, G. Nithya and P. Kumar, "Study of the Sticking Effects during Mechanical Nano-manipulation Using Shape Memory Nanotools", IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO), 4-8 Aug. Zhenjiang, China (2019) 130
22. A. Irzhak, V. Koledov, T. Zhuravleva and P. Kumar, "Melting of Metal Nano Particles for Nanoassembling", IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO), 4-8 Aug. Zhenjiang, China (2019) 78
21. S. Kumar, E. Abraham, S. Talukder, P. Kumar and R. Pratap "Micro Electrolithography System Development", 2018 4th IEEE International Conference on Emerging Electronics (ICEE), 17-19 December, Bangalore (2018)
20. P. Kumar, R. Pratap, S. Talukder, S. Kumar, V. Shashtri, R. Maurya and M. Swamy K. B. "Patterning Cr Film by Passing Electric Current Through a Traversing Pointy Stylus: Introduction to Electrolithography and Its Prospects", 2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO), 13-17 August, Hangzhou (2018) 181
19. P. Kumar, V. Koledov, S. von Gratowski, R. Pratap, A. Irzhak, A. Zhikharev, A. Orlov, P. Lega, S. Talukder, S. Kumar and V. Shashtri, "Electrical Jointing at Micro- and Nanoscale by Electromigration and Mechanical Nano-Manipulation for Bottom-Up Nano-Assembling", 2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO), 13-17 August, Hangzhou (2018) 167
18. N. Somaiah and P. Kumar, "Observation of Inverse Blech Length Effect during Electromigration of Cu Thin Film", Proc. 19th International Conference on Microelectronics and Microsystems Technology (ICMMT), Zurich Switzerland 19 (7 -Part XVII)(2017) 2142
17. P. Jagtap and P. Kumar, "Macro and Micro-Texture Study for Understanding Whisker Growth in Sn Coatings", IEEE Proc. EPTC (2016) 165.
16. P. Jagtap and P. Kumar, "Understanding Whisker Growth: Effect of Substrate and Underlayer", Proc. of 49th International Microelectronics Assembly and Packaging Society (IMAPS) (2016) 000512
15. S. Talukder, P. Kumar and R. Pratap, “Nanoscale Patterning in Ambient Conditions using Liquid Electromigration”, Proc. SPIE 9777 (2016); doi:10.1117/12.2219024
14. S. P. Singh and P. Kumar, "Relationship between Exhaustion of Dislocation Density and Observation of Classical Harper-Dorn Creep in LiF Single Crystals", Conference proceedings, 7th International Conference on Creep, Fatigue and Creep-Fatigue Interaction, (2016) 213
13. I. Dutta, J. Liu, K. Mireles, P. Kumar and L. Meinshausen, "Interfacially Engineered Micro and Nano-Scale Cu-In Composites as High Performance Thermal Interface Materials for Advanced Electronics", IEEE Proc. EPTC (2014) 635
12. B. Talebanpour, U. Sahaym, I. Dutta and P. Kumar, “Effect of Aging on Impression Creep Behavior of Pb-Free Solders" ASME - Proc. InterPACK (2013) V001T07A005.
11. Z. Chen, B. Talebanpour, Z. Hunag, P. Kumar and I. Dutta, “Effect of Processing on Microstructure and Fracture of Solder Microbumps in 3-D Packages" IEEE Proc. EPTC (2013) 534.
10. P. Kumar, B. Talenbanpour, U. Sahaym, C. H. Wen and I. Dutta, “Microstructural Evolution and Some Unusual Effects during Thermo-Mechanical Cycling Of Sn-Ag-Cu Alloys" IEEE - Proc. ITherm (2012) 880. (Best paper award)
9. S. Chavali, Y. Singh, P. Kumar, G. Subbarayan, I. Dutta and D. R. Edwards, “Aging Aware Constitutive Models for SnAgCu Solder Alloys”, IEEE - Proc. ECTC (2011) 701 (Intel best student paper award)
8. J. Liu, P. Kumar, I. Dutta, C. M. Nagaraj, R. Raj, M. Renavikar and R. Mahajan, “Effect of Interfacial Layers on the Performance of Cu-In Liquid Phase Sintered Composites as Thermal Interface and Interconnect Materials”, ASME - Proc. InterPACK (2011) 773
7. Z. Huang, P. Kumar, I. Dutta, J. H. L. Pang, R. Sidhu, M. Renavikar and R. Mahajan, "Fracture Mechanism Map for the Fracture of Microelectronic Pb-free Joints under Dynamic Loading Conditions", IEEE - Proc. EPTC (2010) 298 (Best paper award)
6. Z. Huang, P. Kumar, I. Dutta, G. Subbarayan, V. Gupta, D. Chan and C. H.Wen, "Development of a Microstructurally Adaptive Unified Primary cum Secondary Creep Model for SAC387 Solder Joints", IEEE - Proc. ITherm (2010) 1
5. J. Liu, P. Rottman, S. Dutta, P. Kumar, R. Raj, M. Renavikar and I. Dutta, "Next Generation Materials for Thermal Interface and High Density Energy Storage Applications via Liquid Phase Sintering", IEEE - Proc. EPTC (2009) 506
4. J. Liu, P. Kumar, I. Dutta, R. Raj, and M. Renavikar, "Next Generation Solder Systems for Thermal Interface and Interconnect Applications via Liquid Phase Sintering", ASME - Proc. InterPACK (2009) 385
3. P. Kumar, I. Dutta, V. Sarihan, D. R. Frear, S. Jadhav and M. Renavikar, "Effects of Strain Rate and Aging on Deformation and Fracture of Sn-Ag-Cu Solder Joints", IEEE - Proc. ITherm (2008) 660 (Best paper award - Mechanics track)
2. P. Kumar, I. Dutta, R. Raj, M. Renavikar and V. Wakharkar, "Novel Liquid Phase Sintered Solders with Indium as Minority Phase for Next Generation Thermal Interface Materials Applications", IEEE - Proc. ThETA 2 (2008) 339
1. P. Kumar, O. Cornejo, I. Dutta, G. Subbarayan and V. Gupta, "Joint Scale Dependence of Aging Kinetics in Sn-Ag-Cu Solders", IEEE - Proc. EPTC (2008) 903
Invited Talks
51. “Influence of Sample Geometry on Creep Response at Meso-Length Scale”, Intel Corporation, Chandler, March 2024 (USA)
50. “Unifying Strain Gradient and Surface-Proximity Effects for Understanding Length Scale Effects on Power-Law Creep”, 7th International Indentation Workshop – IIW7 (2023), Hyderabad, December 2023 (India)
49. “On “Threshold” Creep Deformation Behavior of Ni-Based Superalloys”, METCENT 2023, IIT BHU, October 2023 (India)
48. “High Throughput Determination of Creep Behavior of Additively Manufactured Alloys: A Case for DIC-Augmented-Bending Creep of LPBF Al Alloys”, Processing and Fabrication of Advanced Materials (PFAM29), IIT Tirupati, September 2023 (India)
47. “Effect of Joint Length Scale on Creep of Sn-Rich Dissimilar Metallic Joints”, Third International Conference on Structural Integrity (ICONS 2023), IGCAR, Kalpakkam, August 2023 (India)
46. “DIC-Augmented-Bending as a High Throughput Mechanical Testing Method: A Few Examples”, Pratt & Whitney, East Hartford, June 2023 (USA)
45. “Bending Creep of Materials: Rediscovering an Old Alternate Method for Mechanical Testing”, John Hopkins University, Baltimore, June 2023 (USA)
44. “Effect of Electric Current on Pre-cracked Thin Metallic Sheets: From Crack Propagation to Crack Healing”, 15th International Conference on Fracture (ICF15), Atlanta, June 2023 (USA)
43. “Effect of joint length scale on creep deformation of Sn-rich dissimilar metallic joints”, Electronic Packaging and Interconnection, TMS 2023, San Diego, March 2023 (USA)
42. “Effect of Electric Current on Pre-cracked Thin Metallic Sheets: From Crack Healing to Their Propagation”, Indian Structural Interity Society (InSIS) (Online) March 2023
41. “Carbon Nanotube Foams: From Fundamentals of Mechanical Response to Potential Applications”, Technology for Environmental Sustainability, Socio-Economic Responsibility and Associated Entrepreneurial Opportunities in Society and Rural Environment, Sri Aurobindo College (Delhi University) March 2023
40. “High Throughput Evaluation of Mechanical Properties: A Few Examples”, Indian Institute of Technology, Delhi, February 2023
39. “Effect of Electric Field on Mechanical Behavior of Materials”, SICE 2022, Indian Institute of Technology Hyderabad, December 2022
38. “High Throughput Evaluation of Mechanical Properties Using Small Volume Samples”, Discussion Meeting on Emerging Trends in the Science and Engineering of Structural Materials, Coorg, December 2022
37. “Effect of Sample Geometry on Size-Effect of Power-Law Creep”, 76th Annual Technical Meeting of The Indian Institute of Metals (IIM ATM) 2022, Hyderabad, November 2022
36. “Effect of High-Pressure Torsion on Mechanical and Electrical Properties: A Test Case of CP Cu”, Advances in Materials & Processing: Challenges & Opportunities (AMPCO), IIT Roorkee, October 2022
35. “Estimation of Orientation, Composition and Temperature Effects on Modulus and Hardness of Ni-x-Al Alloys using Nanoindentation”, Nanomechanical & Nanotribological Testing, 1-day Scientific Workshop, Indian Institute of Technology, Tirupati, 3rd June 2022
34. “Bending Creep of Materials: Rediscovering an Old Alternate Method for Creep Testing”, Indian Institute of Metals and Indian Institute of Technology, Kanpur, April 2022
33. “Bending Creep”, Indian Institute of Technology Patna, April 2022
32. “Understanding Sample Size Effects on Creep Micromechanics Using In-Situ Testing”, Electron Microscopy Society of India (EMSI), IIT Kanpur, July 2021 (India)
31. “New Insights into Creep in the So-Called Harper-Dorn Creep Regime”, Structural Integrity Conference (SICE 2020) of Indian Structural Integrity Society, IIT Bombay, December 2020 (India)
30. “Length Scale Effects on Power Law Creep: Cases of Uniform and Graded Stress Fields”, Structural Integrity Conference (SICE 2020) of Indian Structural Integrity Society, IIT Bombay, December 2020 (India)
29. “Mechanical Testing in Small Volumes and High Throughput”, Indian Academy of Sciences-IISc Workshop on High Temperature Materials, Coorg, December 2020 (India)
28. “Effect of Thermomigration-Electromigration Coupling on Mass Transport in Cu Thin Films”, Jawaharlal Nehru University, New Delhi, November 2020 (India)
27. “Electric Current Induced Failure of Pre-Cracked Thin Metallic Structures: From Experimental Observations to Applications”, IIT Kanpur, October 2020 (India)
26. “Effect of Electric Field on Mechanical Behaviour of CNT Forests”, Nanoscience and Nanotechnology in the Present Scenario, Jawaharlal Nehru University, Delhi, June 2020 (India)
25. “Effect of Electric Current on Structural Reliability of Microelectronic Packages”, 16th Annual Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Lead-Free Solder Workshop, TMS 2020 San Diego, USA 23--27 February 2020
24. “Effect of High-Pressure Torsion on Mechanical and Electrical Behavior of Commercially Pure Cu”, Ultrafine-grained and Heterostructured Materials (UFGH XI), TMS 2020, San Diego, 23-27 February 2020
23. ““High Throughput Determination of Creep Parameters Using Cantilever Bending”, Pratt and Whitney, East Hartford, February 2020 (USA)
22. “Effect of High Pressure Torsion on Hardness and Electrical Resistivity of Commercially Pure Cu”, 6th Bulk Nano-Materials (BNM: 2019), Ufa, Russia 25-27 September 2019
21. “Electric Current Induced Failure of Pre-Cracked Thin Metallic Structures: Synergetic Effects of Mechanical Load and Magnetic Field”, IIT Patna, July 9th, 2019
20. “Creep in Bending: Current Status and Prospects for Small Volume Testing”, Indira Gandhi Centre for Atomic Research, February 7th, 2019
19. “Effect of Electric Current on Failure of Pre-Cracked Thin Metallic Structures” IIT Roorkee Indian Institute of Technology, Roorkee December 12th, 2018
18. “Electric Current Induced Long-Range Flow of Liquid Metals on Conducting Path: Fundamentals and Applications”, Institute of Radio Engineering and Electronics of Russian Academy of Sciences, Moscow, September 14th, 2018
17. “Nano-Mechanics at High Temperatures using Indentation Technique”, in Nanomechanical Testing: Theory and Applications, IIT Madras Chennai, August 5th, 2018
16. “Resolving the Strength-Ductility Paradox through Severe Plastic Deformation”, VIT University, September 28th, 2017
15. "Analyzing Crystallographic Micro-Texture using EBSD for Identifying Whisker Grain and Its Neighborhood in Sn Coatings", International Conference on Texture, Micro-texture and Mechanical Behaviour, ICoTMMB – 2017, February 13-15, 2017, Bangalore (India)
14. "Resolving the Strength-Ductility Paradox through Severe Plastic Deformation of a Cast Al-7Si Alloy”, THERMEC, May 29-June 03, 2016, Graz (Austria)
13. "Can Severe Plastic Deformation Resolve High Strength-High Ductility Paradox?", Indo-US Workshop on Frontiers of Structural Materials Research, February 22-26, 2015, Coorg (India)
12. "Effect of Electric Field on Mechanical Behavior of CNT Foams", Department of Mechanical Engineering, IIT Bombay, July 21, 2014, Mumbai (India)
11. "Electric Current Induced Mass Transport in Liquid Metals: Phenomenon and Applications", Center for Nano-Science and Engineering, IISc, October 31, 2013, Bangalore (India)
10. "Electromigration-Assisted Diffusionally Accommodated Interfacial Sliding at Hetero-Interfaces", MACAN CapStone Conference, April 20-25, 2013, Haifa (Israel)
9. "Electric Current Induced Long-range Flow of Liquid Metals", Department of Chemical Engineering, IISc, March 21, 2013, Bangalore (India)
8. "Reliability Concerns in Microelectronic Packages due to Interactions between Stress, Temperature and Electric Current", Workshop on Mechanical Behaviour of Systems at Small Length Scales, February 24-28, 2013, Coorg (India)
7. "Electric Current Assisted Interfacial Sliding at Hetero-Interfaces" Workshop of Indian Nanoelectronics User Programme, October 29 - 31, 2012, Bangalore (India)
6. "Mixed Mode Fracture Behaviour of Sn-Ag-Cu Solder Joints", NRC-M symposium on Mechanical Behaviour of Materials, Jan 30-31, 2012, Bangalore (India)
5. "Thermal Cycling and Electromigration Induced Interfacial Sliding in Cu Filled Through Si Vias (TSVs)", Workshop on Mechanical Behaviour of Systems at Small Length Scales, September 16-20, 2011, Trivendarum (India)
4. "Characterization of Microelectronic Interconnects", NRC-M Summer Workshop on Structural Characterization Techniques in Materials Science, June 27 - July 14, 2011, Bangalore (India)
3. "Microelectronic Packaging: Key Avenues for Materials Scientists and Engineers", National Conference on Recent Trends in Materials Chemistry and Engineering, RTMCE, September 29-30, 2011, Bangalore (India)
2. "Effects of Electromigration and Stress on Interfacial Sliding", Washington State University, April 14, 2011, Pullman (USA)
1. "Effects of Microstructure and Its Evolution on Deformation and Fracture Behavior of lead-free Solders", Department of Materials Science and Materials Engineering, IIT Bombay, January 10, 2010, Mumbai (India)