Thin film residual stress

Model
:
KLA Tencor FLX 2320
Specifications
:

Measures curvature of plates and beams using laser. Heating stage upto 500C in ambient atmospheres or under inert gas shrouding . Liquid nitrogen can circulated to reach temperatures down to 0 C. Dual beam enables stresses measurements for transparent coatings as well.

Procedure
:
Measure the curvature of substrate before and after the deposition and, knowing the substrate and film thickness and substrate elastic modulus, use Stoney’s equation to find the stress.
Statical Strain
:
Maximum size is 8 inches wafer. Plates, disks, beams with longest measurable length less than 8 inches dia. can also be used.
Faculty in charge
:
Vikram Jayaram
Contact person
:
Students trained to use the instrument: Sumanth G, Nisha Verma